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Modular Low-Power, High-Speed CMOS Analog-to-Di. Keh-la-Lin, Hosticka, Kemna<|

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Item specifics

Condition
New: A new, unread, unused book in perfect condition with no missing or damaged pages. See the ...
Title
Modular Low-Power, High-Speed CMOS Analog-to-Digital Converter o
ISBN
9781402073809
Subject Area
Electrical Engineering
Publication Name
Modular Low-Power, High-Speed Cmos Analog-To-Digital Converter of Embedded Systems
Publisher
Springer-Verlag New York Inc.
Subject
Physics
Publication Year
2003
Series
The Springer International Series in Engineering and Computer Science
Type
Textbook
Format
Hardcover
Language
English
Item Height
235 mm
Author
Keh-La Lin, Bedrich J. Hosticka, Armin Kemna
Item Weight
1270 g
Item Width
155 mm
Number of Pages
254 Pages

About this product

Product Information

One of the main trends of microelectronics is toward design for integrated systems, that is, system-on-a-chip (SoC) or system-on-silicon (SoS). Due to this development, design techniques for mixed-signal circuits become more important than before. Among other devices, analogue-to-digital and digital-to-analog converters are the two bridges between the analogue and the digital worlds. Besides, low-power design technique is one of the main issues for embedded systems, especially for hand-held applications. This work discusses design techniques for low-power, high-speed analogue-to-digital converter processed by the standard CMOS technology. Additionally the text covers physical integration issues of A/D converter integrated in SoC, that is, substrate crosstalk and reference voltage network design.

Product Identifiers

Publisher
Springer-Verlag New York Inc.
ISBN-13
9781402073809
eBay Product ID (ePID)
89580570

Product Key Features

Number of Pages
254 Pages
Language
English
Publication Name
Modular Low-Power, High-Speed Cmos Analog-To-Digital Converter of Embedded Systems
Publication Year
2003
Subject
Physics
Type
Textbook
Author
Keh-La Lin, Bedrich J. Hosticka, Armin Kemna
Subject Area
Electrical Engineering
Series
The Springer International Series in Engineering and Computer Science
Format
Hardcover

Dimensions

Item Height
235 mm
Item Weight
1270 g
Item Width
155 mm
Volume
722

Additional Product Features

Country/Region of Manufacture
United States
Title_Author
Keh-La Lin, Armin Kemna, Bedrich J. Hosticka

Item description from the seller

Business seller information

WRAP Ltd.
Mubin Ahmed
Unit 4
119 Loverock Road
Reading
Berkshire
RG30 1DZ
United Kingdom
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:enohP60358080080
:liamEmoc.aidemtumahab@yabe
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  • 03800600
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CRN Number:
  • 03800600
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