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Microelectroni cs Packaging Handbook: Technology Drivers Part I [H
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Located in: Upper Marlboro, Maryland, United States
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Estimated between Thu, 9 May and Mon, 13 May to 43230
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eBay item number:144592247814
Item specifics
- Condition
- Book Title
- Microelectronics Packaging Handbook: Technology Drivers Part I [H
- Inscribed
- No
- Signed By
- No
- Ex Libris
- No
- Signed
- No
- Personalized
- No
- Vintage
- No
- Custom Bundle
- No
- Subject
- Non Fiction
- Genre
- Non Fiction
- Narrative Type
- Non Fiction
- Personalize
- No
- Intended Audience
- General
- ISBN
- 9780412084317
- EAN
- 9780412084317
- Publication Year
- 1997
- Type
- Textbook
- Format
- Hardcover
- Language
- English
- Publication Name
- Microelectronics Packaging Handbook Vol. 2, Pt. 1 : Technology Drivers
- Features
- Revised
- Item Length
- 9.3in
- Publisher
- Springer
- Item Width
- 6.1in
- Item Weight
- 48.9 Oz
- Number of Pages
- Xxvii, 720 Pages
About this product
Product Information
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Product Identifiers
Publisher
Springer
ISBN-10
0412084317
ISBN-13
9780412084317
eBay Product ID (ePID)
169764
Product Key Features
Publication Name
Microelectronics Packaging Handbook Vol. 2, Pt. 1 : Technology Drivers
Format
Hardcover
Language
English
Features
Revised
Publication Year
1997
Type
Textbook
Number of Pages
Xxvii, 720 Pages
Dimensions
Item Length
9.3in
Item Width
6.1in
Item Weight
48.9 Oz
Additional Product Features
Number of Volumes
1 Vol.
Lc Classification Number
Tk7867-7867.5
Grade from
College Freshman
Edition Description
Revised Edition
Edition Number
2
Reviews
'A most comprehensive book set, both well presented and well illustrated.' IEEE Electrical Insulation Magazine, September/October 1997
Table of Content
1. Microelectronics Packaging Handbook: Technology Drivers.- 1. Microelectronics Packaging--An Overview.- 2. Package Wiring and Terminals.- 3. Package Electrical Design.- 4. Heat Transfer in Electronic Packages.- 5. Package Reliability.- 6. Package Manufacture.- Glossary and Symbols.- Authors' Biographies.
Copyright Date
1997
Topic
Industrial Design / Packaging, Hardware / General, Electronics / Microelectronics, Electronics / Circuits / General, Manufacturing
Lccn
96-037907
Dewey Decimal
621.381/046
Intended Audience
Scholarly & Professional
Dewey Edition
21
Illustrated
Yes
Genre
Computers, Technology & Engineering
Item description from the seller
Seller assumes all responsibility for this listing.
eBay item number:144592247814
Postage and packaging
Item location:
Upper Marlboro, Maryland, United States
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