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Microelectronics Packaging Handbook: Technology Drivers Part I [H

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Item specifics

Condition
Very Good: A book that has been read and does not look new, but is in excellent condition. No ...
Book Title
Microelectronics Packaging Handbook: Technology Drivers Part I [H
Inscribed
No
Signed By
No
Ex Libris
No
Signed
No
Personalized
No
Vintage
No
Custom Bundle
No
Subject
Non Fiction
Genre
Non Fiction
Narrative Type
Non Fiction
Personalize
No
Intended Audience
General
ISBN
9780412084317
EAN
9780412084317
Publication Year
1997
Type
Textbook
Format
Hardcover
Language
English
Publication Name
Microelectronics Packaging Handbook Vol. 2, Pt. 1 : Technology Drivers
Author
Eugene J. Rymaszewski, Alan G. Klopfenstein, Rao R. Tummala
Features
Revised
Item Length
9.3in
Publisher
Springer
Item Width
6.1in
Item Weight
48.9 Oz
Number of Pages
Xxvii, 720 Pages

About this product

Product Information

Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool­ ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Product Identifiers

Publisher
Springer
ISBN-10
0412084317
ISBN-13
9780412084317
eBay Product ID (ePID)
169764

Product Key Features

Author
Eugene J. Rymaszewski, Alan G. Klopfenstein, Rao R. Tummala
Publication Name
Microelectronics Packaging Handbook Vol. 2, Pt. 1 : Technology Drivers
Format
Hardcover
Language
English
Features
Revised
Publication Year
1997
Type
Textbook
Number of Pages
Xxvii, 720 Pages

Dimensions

Item Length
9.3in
Item Width
6.1in
Item Weight
48.9 Oz

Additional Product Features

Number of Volumes
1 Vol.
Lc Classification Number
Tk7867-7867.5
Grade from
College Freshman
Edition Description
Revised Edition
Edition Number
2
Reviews
'A most comprehensive book set, both well presented and well illustrated.' IEEE Electrical Insulation Magazine, September/October 1997
Table of Content
1. Microelectronics Packaging Handbook: Technology Drivers.- 1. Microelectronics Packaging--An Overview.- 2. Package Wiring and Terminals.- 3. Package Electrical Design.- 4. Heat Transfer in Electronic Packages.- 5. Package Reliability.- 6. Package Manufacture.- Glossary and Symbols.- Authors' Biographies.
Copyright Date
1997
Topic
Industrial Design / Packaging, Hardware / General, Electronics / Microelectronics, Electronics / Circuits / General, Manufacturing
Lccn
96-037907
Dewey Decimal
621.381/046
Intended Audience
Scholarly & Professional
Dewey Edition
21
Illustrated
Yes
Genre
Computers, Technology & Engineering

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