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Handbook Of Tape Automated Bonding by John H. Lau (English) Hardcover Book - Picture 1 of 1
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Handbook Of Tape Automated Bonding by John H. Lau (English) Hardcover Book

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Price:
US $275.67
ApproximatelyEUR 254.97
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Located in: Fairfield, Ohio, United States
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eBay item number:364686926477
Last updated on 19 May, 2024 11:17:33 BSTView all revisionsView all revisions

Item specifics

Condition
New: A new, unread, unused book in perfect condition with no missing or damaged pages. See the ...
ISBN-13
9780442004279
Type
NA
Publication Name
NA
ISBN
9780442004279
Book Title
Handbook of Tape Automated Bonding
Item Length
9.2 in
Publisher
Springer
Publication Year
1992
Format
Hardcover
Language
English
Illustrator
Yes
Author
John H. Lau
Genre
Technology & Engineering, Computers
Topic
Hardware / General, Electronics / Circuits / General, Manufacturing, Electrical
Item Width
6.1 in
Item Weight
87.1 Oz
Number of Pages
Xxiv, 646 Pages

About this product

Product Information

Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management and reliability. For professionals active in TAB research and development, those who wish to master TAB problem solving methods, and those who must choose a high-performance and cost-effective packaging technique for their interconnect systems, here's a timely summary of progress in all aspects of this fascinating field.

Product Identifiers

Publisher
Springer
ISBN-10
0442004273
ISBN-13
9780442004279
eBay Product ID (ePID)
945228

Product Key Features

Book Title
Handbook of Tape Automated Bonding
Author
John H. Lau
Format
Hardcover
Language
English
Topic
Hardware / General, Electronics / Circuits / General, Manufacturing, Electrical
Publication Year
1992
Illustrator
Yes
Genre
Technology & Engineering, Computers
Number of Pages
Xxiv, 646 Pages

Dimensions

Item Length
9.2 in
Item Width
6.1 in
Item Weight
87.1 Oz

Additional Product Features

Number of Volumes
1 Vol.
Lc Classification Number
Tk7867-7867.5
Table of Content
Foreward; Preface; Acknowledgments; A brief introduction to tape automated bonding; Electrical performance of tape automated bonding; First-level packaging costs: tape bonding versus other high-lead package options; Materials choices for tape automated bonding; TAB tape design and manufacturing; Wafer bumping; TAB inner lead bonding; TAB testing and burn-in; TAB encapsulation; TAB outer lead bonding; Equipment selection for TAB outer lead bonding; TAB inspection and rework; TAB thermal management; Reliability aspects of tape automated bonding; Multichip packaging with TAB; Interconnection substrates for TAB devices; TAB developments and trends in Europe; TAB developments and trends in Japan; TAB implementation: a case study in the military environment; TAB Implementation: a case study in the commercial environment; Index
Copyright Date
1992
Lccn
91-040497
Dewey Decimal
621.381046
Dewey Edition
20

Item description from the seller

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Premier Books LLC
David Taylor
26C Trolley Sq
19806-3356 Wilmington, DE
United States
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