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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Sol

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eBay item number:386720580657
Last updated on 19 May, 2024 12:47:56 BSTView all revisionsView all revisions

Item specifics

Condition
New: A new, unread, unused book in perfect condition with no missing or damaged pages. See the ...
ISBN-13
9783662517253
Type
NA
Publication Name
NA
ISBN
9783662517253
Book Title
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-Free Solder Joint Interfaces
Book Series
Springer Theses Ser.
Publisher
Springer Berlin / Heidelberg
Item Length
9.3 in
Publication Year
2016
Format
Trade Paperback
Language
English
Illustrator
Yes
Author
Qingke Zhang
Genre
Technology & Engineering, Science
Topic
Mechanics / General, Materials Science / Thin Films, Surfaces & Interfaces, Mechanics / Solids
Item Weight
89.1 Oz
Item Width
6.1 in
Number of Pages
Xv, 143 Pages

About this product

Product Information

Research Progress in Pb-free Soldering.- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface.- Tensile-compress Fatigue Behavior of Solder Joints.- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints.- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints.- Conclusions.

Product Identifiers

Publisher
Springer Berlin / Heidelberg
ISBN-10
3662517256
ISBN-13
9783662517253
eBay Product ID (ePID)
248115619

Product Key Features

Book Title
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-Free Solder Joint Interfaces
Number of Pages
Xv, 143 Pages
Language
English
Publication Year
2016
Topic
Mechanics / General, Materials Science / Thin Films, Surfaces & Interfaces, Mechanics / Solids
Illustrator
Yes
Genre
Technology & Engineering, Science
Author
Qingke Zhang
Book Series
Springer Theses Ser.
Format
Trade Paperback

Dimensions

Item Weight
89.1 Oz
Item Length
9.3 in
Item Width
6.1 in

Additional Product Features

Number of Volumes
1 Vol.
Lc Classification Number
Ta349-359
Table of Content
Research Progress in Pb-free Soldering.- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface.- Tensile-compress Fatigue Behavior of Solder Joints.- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints.- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints.- Conclusions.
Copyright Date
2016

Item description from the seller

Business seller information

Premier Books LLC
David Taylor
26C Trolley Sq
19806-3356 Wilmington, DE
United States
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